At a press conference held in China, HiSilicon (owned by Huawei) officially unveiled their new chipset – Kirin 960. It is an octa-core processor which uses four high-powered Cortex-A73 cores and four low-powered A-53 cores. It is based on 16nm FinFET process node. It also uses ARM’s Mali-G71 MP8 GPU for improved gaming performance.
The Kirin 960 is expected to power the Huawei Mate 9, company’s next flagship smartphone to be announced in November. At the press conference, the company compared the processor with an iPhone 7 Plus which is powered by A10 and Samsung Galaxy Note 7 which is powered by Snapdragon 820, demonstrating 14 different apps. 13 apps out of these launched fastest on Kirin 960 as opposed to other flagship devices. Though Apple’s A10 processor ruled in single core scores, however, Kirin 960 won the race in multi-core test.
The company also claimed that the Mali-G71 GPU used with Kirin 960 is 180% faster than its predecessor Mali-T880. Kirin also uses UFS 2.1 storage support for improved read-write performance.
Talking about the connectivity, Kirin 960 supports native CDMA, up to four component carriers (4CC) which make it possible to hit the peak data speed od 600Mbps. It also extends supports for Cat. 12 LTE for downloads and Cat. 13 for uploads.
HiSilicon also claimed to improve the camera capabilities with this chipset, by featuring new and improved ISP (image signal processor). Talking about the security, the company announced that Kirin 960 is certified by UnionPay and the People’s Bank of China for the use of mobile payments. It also claims to add a 3-tier security system and support for financial industry standard encryption techniques.