Le X850 is going to be LeEco’s new high-end device which the company is going to launch in early next year. Recently, LeEco Le X850 was spotted while making rounds at TENAA certification in China.
The TENAA listing revealed the specs and images of the device. According to the listing, the device will sport a 5.7-inch Quad HD display with curved glass. The images showed the device to be a metal unibody design smartphone featuring an ultrasonic fingerprint sensor at the back.
The device is expected to be powered by the latest Snapdragon 821 processor coupled with 4GB of DDR3 RAM. The device will house 64GB of inbuilt storage and weighs 185 grams. The LeEco Le X850 will run on Android Marshmallow with company’s EUI 5.8 on top. It also features dual 13-megapixel cameras at back with dual-tone LED flash and a 16-megapixel front facing camera.
It is a 4G-enabled phone and packs in a 3900mAh battery which supports fast charging with Qualcomm Quick Charge 3.0. Talking about the connectivity, the dual SIM phone Le X850 features an IR sensor, Wi-Fi 802.1 ac, Bluetooth 4.2, and GPS. It also features USB Type-C port for charging and data.
Key Specifications of the LeEco Le X850
|Display||5.7-inch (Quad HD)|
|Processor||2.35 GHz Quad-Core Snapdragon 821|
|Camera||13MP Dual Rear Camera Setup, 16MP Front|
|Operating system||Android 6.0 Marshmallow|