Taiwanese chipmaker and Qualcomm’s rival MediaTek has started sending out the invites for the launch of new chipsets – Helio P23 & Helio P30. The launch event is scheduled in Beijing on 29th August where these two chipsets will be announced.
The Helio P23 is an octa-core chipset built on the 16nm process. It is said to support dual rear camera setup as well as 2K resolution. The chipset is also expected to feature Cat.7 connectivity and LPDDR4X memory. As per the rumours, the Helio P23 chipset will be seen powering Oppo, Xiaomi, Vivo, and Meizu smartphones starting the fourth quarter of this year.
The Helio P30, on the other hand, will be the most powerful P series chipset from the company. It is said to be manufactured on 12nm process comprising one cluster of four Cortex A53 cores and another cluster of four Cortex A72 cores. All the cores, however, are clocked at the same 1.5GHz clock speed. For connectivity, the chipset gets Cat.10 modem supporting up to 600Mbps of theoretical download speed. It is being said that the production capacity of both the chipsets is expected to over 3 million shipments per month.