MediaTek Dimensity 1050 processor has been launched. Alongside, the Taiwanese chipmaker has also announced Dimensity 930 and Helio G99 processors.
The Dimensity 1050 SoC is a stripped-down version of last year’s Dimensity 1100 whereas the Helio G99 arrives as the successor to the Helio G96. All three newly announced processors are said to debut in smartphones later this year.
MediaTek announces three new processors
The Dimensity 1050 is the first processor from MediaTek to support dual mmWave and sub-6GHz 5G connectivity. It is an octa-core chipset based on a 6nm fabrication process. The SoC comprises two ARM Cortex-A78 performance cores clocked at 2.5GHz and six ARM Cortex-A55. It also packs Mali-G610 GPU. The Dimensity 1050 processor supports up to 144Hz FHD+ display with HDR10+ and Dolby Vision. It also supports LPDDR5 RAM technology, UFS 3.1 storage and HyperEngine 5.0 for better gaming performance.
On the optics front, the Dimensity 1050 SoC supports up to 108MP primary camera. The chipset offers 3CC carrier aggregation on the sub-6GHz spectrum and 4CC on mmWave. It also supports WiFi-6E, 2×2 MIMO, and Bluetooth 5 connectivity.
As for the MediaTek Dimensity 930, it is an octa-core processor with a peak speed of 2.2GHz. It supports an FHD+ display with a 120Hz refresh rate. The Helio G99 SoC is claimed to offer more than 30 percent power savings for gaming compared to its predecessor i.e. Helio G96.
The MediaTek Dimensity 930 will be available in the market in the second quarter of 2022 whereas the Dimensity 1050 and Helio G99 will power smartphones in the third quarter of 2022.