Last month, MediaTek had announced its first processor in the Dimensity lineup. Called the Dimensity 1000 5G, the SoC is aimed at high-end smartphones. It is built on 7nm architecture and comes with an integrated 5G modem. Now, the Chipset maker has unveiled another processor in the series – the Dimensity 800. It is for mid-range smartphones and will be positioned below the Dimensity 1000 5G. MediaTek hasn’t revealed many specifications of its latest processor. However, we do know that the Dimensity 800 SoC will be launched in Q1 2020 and make its way into smartphones from the second quarter of the year. The processor is expected to compete against Snapdragon’s 7xx series chipset which is found in mid-range and upper mid-range devices.
MediaTek Dimensity 1000 5G specifications
To recall, the Dimensity 1000 5G is an octa-core chipset featuring four Cortex A77 cores and A55 cores ticking at 2.6GHz and 2.0GHz respectively. For graphics, the processor is paired with a Mali-G77 MP9 GPU onboard. It comes with an integrated Helio M70 5G modem offering download and upload speeds of 4.7Gbps and 2.5Gbps respectively. The chipset supports both standalone and non-standalone networks. The Dimensity 1000 5G comes with a dual cluster arrangement instead of tri-cluster that is seen on the Kirin 990, Snapdragon 855 and Exynos 990. The processor is capable of supporting up to 16GB LPDDR4x RAM.
The Dimensity 1000 5G will make its presence in the smartphones launching in China and other Asia regions from the end of this year. The OPPO Reno 3 is already confirmed to be powered by this processor. US and EU markets will receive the new chipset in the second half of 2020.
With the Dimensity 1000 5G processor, the brand seems to have re-entered the flagship processor segment and aims to take on the likes of Qualcomm’s Snapdragon, Huawei’s, Kirin, and Samsung’s Exynos processors.