MediaTek Dimensity 9000 processor has been announced as the next flagship chipset from the Taiwan-based fabless semiconductor company. The Dimensity 9000 is the world’s first TSMC chip based on 4nm architecture and the most powerful SoC yet from the Taiwanese chipmaker.
MediaTek’s latest Dimensity 9000 processor will compete against the likes of Qualcomm and Samsung’s flagship chips. Qualcomm is expected to launch the successor to last year’s Snapdragon 888 later this month. Let’s delve in to the technical specifications of the Dimensity 9000 below.
MediaTek Dimensity 9000 processor specifications and features
The MediaTek Dimensity 9000 is built on a 4nm process that is said to offer advanced performance and power efficiency. It also utilises ARM’s new v9 architecture that consists of a single ARM Cortex X2 core clocked at 3.05GHz, three Cortex A710 cores up to 2.85GHz, and lastly four Cortex A510 cores. The SoC supports LPDDR5x RAM technology with speeds up to 7500Mbps.
The Dimensity 9000 is equipped with the world’s first ARM Mali-G710 GPU with 10 cores and support for raytracing SDK that will allow developers to improve the graphics performance for gaming. The GPU is capable of delivering an FHD+ display at a 180Hz refresh rate.
The MediaTek Dimensity 9000 comes with an 18-bit Imagiq Gen 7 HDR Image Signal Processor. It supports 4K HDR video capture on three cameras simultaneously. The processor is also the first in the industry to support 320MP camera resolution on smartphones.
Connectivity-wise, the MediaTek Dimensity 9000 features an integrated 5G modem with support for sub-6GHz networks. It is claimed to offer download speeds of 7Gbps with 3CC carrier aggregation. The chipset is touted to be the first to support Bluetooth 5.3 connectivity and also features WiFi 6E 2×2 and wireless stereo audio.