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Qualcomm Snapdragon 765 and 765G SoCs with integrated 5G announced

At the ongoing Qualcomm Summit 2019 event, the chipset maker has introduced a bunch of products including its latest flagship processor called the Snapdragon 865. In addition, the company has also announced two new Snapdragon 7xx series SoCs dubbed the Snapdragon 765 and Snapdragon 765G. Both the latest Snapdragon 7xx series processors flaunt integrated support for next-gen 5G networks, unlike the Snapdragon 865 that relies on X55 modem for the 5G connectivity. Notably, a handful of phone makers including XiaomiOPPO, and Nokia have already announced that they will be introducing smartphones powered by the Snapdragon 765 and Snapdragon 765G processors in the near future. In addition, the brand has introduced its latest in-display fingerprint solution called the 3D Sonic Max.

Qualcomm Snapdragon 765 series processors have built-in 5G modems

Qualcomm Snapdragon 765 and 765G specifications and features

Qualcomm’s latest Snapdragon 765 and Snapdragon 765G processors will provide 5G connectivity for upper mid-range smartphones. They are equipped with Qualcomm’s Snapdragon X52 5G modem, which is touted to provide peak download speeds of up to 3.7Gbps. They are equipped with the Snapdragon Elite Gaming features, which are claimed to provide 25 percent improved gaming experience.

The new Snapdragon 7xx series processors are also equipped with advanced artificial intelligence features. Notably, the Snapdragon 765G is a gaming-centric processor. Unfortunately, the company hasn’t yet revealed the complete specifications of the Snapdragon 765 series chipsets at the moment. The Xiaomi Redmi K30 and OPPO Reno 3 Pro will be the first to utilise these chipsets. HMD Global has also announced that it will be introducing a 5G Nokia phone in the first quarter of the next year.

Qualcomm 3D Sonic Max fingerprint sensor specifications and features

Qualcomm’s new 3D Sonic Max fingerprint sensor is capable of authenticating two fingers at the same time

Talking about Qualcomm’s 3D Sonic Max, it is touted to be the world’s largest fingerprint sensor to date, 17 times larger than the first-gen ultrasonic sensor from the brand. The new fingerprint sensor is so big, in fact, that it can be used to authenticate two fingers at the same time. Notably, the 3D Sonic Max also brings vastly improved security features. Qualcomm expects that devices with its new fingerprint scanner will start releasing commercially in the first quarter of next year.

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